Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659878 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2017-05-23 |
JW
Jo-Mei Wang
Overall (2017): #361,899 of 506,227Top 75%
1
Patents 2017