Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748190 | Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation | Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2017-08-29 |
| 9679859 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2017-06-13 |