Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9760670 | Semiconductor device design methods and conductive bump pattern enhancement methods | Wei-Cheng Wu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2017-09-12 |
| 9691840 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2017-06-27 |
| 9588505 | Near non-adaptive virtual metrology and chamber control | Chen-Hua Yu, Chien Rhone Wang, Henry Lo, Jung Cheng Ko, Chih-Wei Lai +1 more | 2017-03-07 |
| 9589857 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2017-03-07 |
| 9553053 | Bump structure for yield improvement | Tzu-Wei Chiu, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen, Hung-An Teng +1 more | 2017-01-24 |