Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653531 | Methods of manufacturing a package | Hsiao-Tsung Yen, Min-Chie Jeng, Hsien-Pin Hu, Chin-Wei Kuo, Chung-Yu Lu +1 more | 2017-05-16 |
| 9627223 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Shih-Wen Huang, Shang-Yun Hou +1 more | 2017-04-18 |
| 9589857 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2017-03-07 |
| 9570366 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzu-Wei Chiu +1 more | 2017-02-14 |