Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773701 | Methods of making integrated circuits including conductive structures through substrates | Yuan-Hung Liu, Ku-Feng Yang, Ming-Tsu Chung, Hsin-Yu Chen, Tsang-Jiuh Wu +1 more | 2017-09-26 |
| 9754831 | Dummy structure for chip-on-wafer-on-substrate | Yi-Hsiu Chen, Jun-Lin Yeh, Yung-Chi Lin, Li-Han Hsu, Wei-Cheng Wu +2 more | 2017-09-05 |