Issued Patents 2017
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Szu-Ying Chen, Wen-De Wang +1 more | 2017-12-19 |
| 9837464 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-12-05 |
| 9818735 | Method of manufacturing a semiconductor device | Cheng-Ying Ho, Wen-De Wang, Dun-Nian Yaung | 2017-11-14 |
| 9812409 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Hsin-Hui Lee, Wen-De Wang, Shu-Ting Tsai | 2017-11-07 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2017-11-07 |
| 9812482 | Frontside illuminated (FSI) image sensor with a reflector | Min-Feng Kao, Dun-Nian Yaung, Jeng-Shyan Lin, Hsun-Ying Huang, Tzu-Hsuan Hsu | 2017-11-07 |
| 9806119 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Dun-Nian Yaung | 2017-10-31 |
| 9786592 | Integrated circuit structure and method of forming the same | Jeng-Shyan Lin, Dun-Nian Yaung, Hsing-Chih Lin, Min-Feng Kao, Hsun-Ying Huang | 2017-10-10 |
| 9780137 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Feng-Chi Hung, Chun-Chieh Chuang, Dun-Nian Yaung | 2017-10-03 |
| 9780134 | Semiconductor device and method of forming the same | Kazuaki Hashimoto, Wei-Chieh Chiang, Pao-Tung Chen | 2017-10-03 |
| 9773828 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Chun-Chieh Chuang, Jeng-Shyan Lin | 2017-09-26 |
| 9764153 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung | 2017-09-19 |
| 9761629 | Image sensor device and method | Dun-Nian Yaung, Feng-Chi Hung, Jeng-Shyan Lin, Shuang-Ji Tsai | 2017-09-12 |
| 9754925 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, U-Ting Chen, Shih Pei Chou | 2017-09-05 |
| 9748304 | Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods | U-Ting Chen, Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Dun-Nian Yaung | 2017-08-29 |
| 9747973 | Solid state storage device and data writing method to prevent data loss during program cycle | Ming-Hsuan Lee, Sen-Ming Chuang | 2017-08-29 |
| 9722109 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Bruce C. S. Chou +2 more | 2017-08-01 |
| 9704910 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2017-07-11 |
| 9699897 | Pad structure | Szu-Ying Chen, Jeng-Shyan Lin, Dun-Nian Yaung, Chia-Wei Liu, Chung-Chuan Tseng | 2017-07-04 |
| 9673246 | Dual metal for a backside package of backside illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Jhy-Ming Hung, Pao-Tung Chen | 2017-06-06 |
| 9673245 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2017-06-06 |
| 9666630 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2017-05-30 |
| 9666624 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung | 2017-05-30 |
| 9659987 | Approach for reducing pixel pitch using vertical transfer gates and implant isolation regions | Tzu-Jui Wang, Yuichiro Yamashita, Seiji Takahashi | 2017-05-23 |
| 9653508 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2017-05-16 |