Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen +1 more | 2017-12-19 |
| 9837464 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-12-05 |
| 9818735 | Method of manufacturing a semiconductor device | Cheng-Ying Ho, Jen-Cheng Liu, Dun-Nian Yaung | 2017-11-14 |
| 9812409 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsin-Hui Lee, Shu-Ting Tsai | 2017-11-07 |
| 9806119 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Jen-Cheng Liu, Dun-Nian Yaung | 2017-10-31 |
| 9773828 | Image sensor device and method of forming same | Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin | 2017-09-26 |
| 9673246 | Dual metal for a backside package of backside illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Ming Hung, Pao-Tung Chen | 2017-06-06 |
| 9673245 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-I Hsu | 2017-06-06 |
| 9653508 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Shuang-Ji Tsai, Yueh-Chiou Lin | 2017-05-16 |
| 9613996 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-04-04 |
| 9576999 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-02-21 |
| 9570497 | Back side illuminated image sensor having isolated bonding pads | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Hsiao-Hui Tseng | 2017-02-14 |
| 9570503 | Ridge structure for back side illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Pao-Tung Chen | 2017-02-14 |