Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806119 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2017-10-31 |
| 9780134 | Semiconductor device and method of forming the same | Kazuaki Hashimoto, Jen-Cheng Liu, Wei-Chieh Chiang | 2017-10-03 |
| 9673246 | Dual metal for a backside package of backside illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Jhy-Ming Hung | 2017-06-06 |
| 9634053 | Image sensor chip sidewall interconnection | Kuo-Chin Huang, Wei-Chieh Chiang, Kazuaki Hashimoto, Jen-Cheng Liu | 2017-04-25 |
| 9570503 | Ridge structure for back side illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Wen-De Wang | 2017-02-14 |
| 9536915 | Image sensor with embedded infrared filter layer | Keng-Yu Chou, Kazuaki Hashimoto, Jen-Cheng Liu, Jhy-Jyi Sze, Wei-Chieh Chiang | 2017-01-03 |