Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818735 | Method of manufacturing a semiconductor device | Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2017-11-14 |
| 9806119 | 3DIC seal ring structure and methods of forming same | Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2017-10-31 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2017-05-30 |
| 9536920 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Tzu-Hsuan Hsu, Shih Pei Chou | 2017-01-03 |