Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2017-05-30 |
HS
Hui-Wen Shen
Overall (2017): #396,660 of 506,227Top 80%
1
Patents 2017