Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842816 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2017-12-12 |
| 9786619 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Ming-Jhe Lee, Kuo-Ming Wu, Cheng-Hsien Chou, Cheng-Yuan Tsai +1 more | 2017-10-10 |
| 9754993 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Hsiao-Hui Tseng, Chih-Yu Lai, Yen-Ting Chiang, Min-Ying Tsai | 2017-09-05 |
| 9754925 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen | 2017-09-05 |
| 9728570 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang +2 more | 2017-08-08 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Hui-Wen Shen +4 more | 2017-05-30 |
| 9653507 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2017-05-16 |
| 9627326 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2017-04-18 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Chia-Chieh Lin | 2017-01-24 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2017-01-03 |
| 9536920 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu | 2017-01-03 |