Issued Patents 2017
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837464 | Backside structure and methods for BSI image sensors | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-12-05 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2017-11-07 |
| 9780137 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Jen-Cheng Liu | 2017-10-03 |
| 9773828 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin | 2017-09-26 |
| 9764153 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2017-09-19 |
| 9728521 | Hybrid bond using a copper alloy for yield improvement | Yu-Cheng Tsai, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Chih-Hui Huang +2 more | 2017-08-08 |
| 9704827 | Hybrid bond pad structure | Sin-Yao Huang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2017-07-11 |
| 9673246 | Dual metal for a backside package of backside illuminated image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Jhy-Ming Hung, Pao-Tung Chen | 2017-06-06 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Sheng-Chau Chen, Shih Pei Chou, Hui-Wen Shen +4 more | 2017-05-30 |
| 9666630 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2017-05-30 |
| 9627430 | Method and apparatus for low resistance image sensor contact | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shuang-Ji Tsai +1 more | 2017-04-18 |
| 9613996 | Backside structure and methods for BSI image sensors | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-04-04 |
| 9576999 | Backside structure and methods for BSI image sensors | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-02-21 |
| 9570503 | Ridge structure for back side illuminated image sensor | Dun-Nian Yaung, Jen-Cheng Liu, Keng-Yu Chou, Pao-Tung Chen, Wen-De Wang | 2017-02-14 |
| 9559244 | CMOS image sensors and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2017-01-31 |