Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754993 | Deep trench isolations and methods of forming the same | Cheng-Hsien Chou, Chih-Yu Lai, Shih Pei Chou, Yen-Ting Chiang, Min-Ying Tsai | 2017-09-05 |
| 9728570 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Chih-Hui Huang, Shyh-Fann Ting +2 more | 2017-08-08 |
| 9704910 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen +1 more | 2017-07-11 |
| 9627326 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2017-04-18 |
| 9570497 | Back side illuminated image sensor having isolated bonding pads | Shuang-Ji Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang | 2017-02-14 |
| 9559244 | CMOS image sensors and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Tzu-Hsuan Hsu | 2017-01-31 |
| 9536810 | Flat pad structure for integrating complementary metal-oxide-semiconductor (CMOS) image sensor processes | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang +2 more | 2017-01-03 |