Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842816 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Yeur-Luen Tu | 2017-12-12 |
| 9837291 | Wafer processing method and apparatus | Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2017-12-05 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2017-09-05 |
| 9728521 | Hybrid bond using a copper alloy for yield improvement | Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +2 more | 2017-08-08 |
| 9728570 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Shyh-Fann Ting +2 more | 2017-08-08 |