Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837421 | Semiconductor arrangement having capacitor separated from active region | Chern-Yow Hsu, Cheng-Jong Wang, Chia-Shiung Tsai, Shih-Chang Liu | 2017-12-05 |
| 9837291 | Wafer processing method and apparatus | Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai | 2017-12-05 |
| 9825040 | Semiconductor arrangement with capacitor and method of fabricating the same | Chern-Yow Hsu, Ming Chyi Liu, Shih-Chang Liu, Chia-Shiung Tsai, Chen-Jong Wang | 2017-11-21 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2017-10-10 |
| 9711555 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Pin-Nan Tseng | 2017-07-18 |
| 9646860 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Ping-Yin Liu, Lan-Lin Chao | 2017-05-09 |
| 9553096 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Chen-Jong Wang | 2017-01-24 |
| 9548376 | Method of manufacturing a semiconductor device including a barrier structure | Po-Chun Liu, Chi-Ming Chen, Chen-Hao Chiang, Chung-Yi Yu, Chia-Shiung Tsai | 2017-01-17 |