Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728453 | Methods for hybrid wafer bonding integrated with CMOS processing | Chia-Shiung Tsai, Ping-Yin Liu | 2017-08-08 |
| 9711555 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2017-07-18 |