Issued Patents 2017
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853091 | Side bottom contact RRAM structure | Chung-Yen Chou, Ching-Pei Hsieh, Shih-Chang Liu | 2017-12-26 |
| 9837605 | Memory cell having resistance variable film and method of making the same | Ching-Pei Hsieh, Fu-Ting Sung, Chern-Yow Hsu, Shih-Chang Liu | 2017-12-05 |
| 9837421 | Semiconductor arrangement having capacitor separated from active region | Chern-Yow Hsu, Cheng-Jong Wang, Shih-Chang Liu, Xiaomeng Chen | 2017-12-05 |
| 9837606 | Resistance variable memory structure and method of forming the same | Fu-Ting Sung, Ching-Pei Hsieh, Chern-Yow Hsu, Shih-Chang Liu | 2017-12-05 |
| 9837291 | Wafer processing method and apparatus | Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Xiaomeng Chen | 2017-12-05 |
| 9825040 | Semiconductor arrangement with capacitor and method of fabricating the same | Chern-Yow Hsu, Ming Chyi Liu, Shih-Chang Liu, Xiaomeng Chen, Chen-Jong Wang | 2017-11-21 |
| 9825117 | MIM/RRAM structure with improved capacitance and reduced leakage current | Jian-Shiou Huang, Yao-Wen Chang, Hsing-Lien Lin, Cheng-Yuan Tsai | 2017-11-21 |
| 9793243 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Yeur-Luen Tu | 2017-10-17 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2017-10-10 |
| 9771256 | Micro electro mechanical system (MEMS) device having via extending through plug | Chung-Yen Chou, Lee-Chuan Tseng, Ru-Liang Lee | 2017-09-26 |
| 9768220 | Deep trench isolation structure for image sensors | Yuan-Tai Tseng, Yu-Hsing Chang, Ming Chyi Liu, Shih-Chang Liu | 2017-09-19 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai +2 more | 2017-09-05 |
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao | 2017-08-29 |
| 9748255 | Split gate memory devices and methods of manufacturing | Chang-Ming Wu, Shih-Chang Liu, Ru-Liang Lee | 2017-08-29 |
| 9748373 | MISFET device | Sheng-De Liu, Ming Chyi Liu, Chung-Yen Chou | 2017-08-29 |
| 9738516 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Ru-Liang Lee, Yuan-Chih Hsieh | 2017-08-22 |
| 9741681 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Lan-Lin Chao | 2017-08-22 |
| 9728719 | Leakage resistant RRAM/MIM structure | Ming Chyi Liu, Yuan-Tai Tseng, Shih-Chang Liu | 2017-08-08 |
| 9728597 | Metal-insulator-metal structure and method for forming the same | Hsing-Lien Lin, Cheng-Yuan Tsai, Huey-Chi Chu, Hai-Dang Trinh, Wen-Chuan Chiang +1 more | 2017-08-08 |
| 9728453 | Methods for hybrid wafer bonding integrated with CMOS processing | Pin-Nan Tseng, Ping-Yin Liu | 2017-08-08 |
| 9722011 | Film scheme for MIM device | Hsing-Lien Lin, Yao-Wen Chang, Cheng-Yuan Tsai | 2017-08-01 |
| 9711555 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Xiaomeng Chen, Pin-Nan Tseng | 2017-07-18 |
| 9704820 | Semiconductor manufacturing method and associated semiconductor manufacturing system | Xin-Hua Huang, Yung-Lung Lin, Ping-Yin Liu | 2017-07-11 |
| 9685518 | Method of forming semiconductor structure of control gate, and semiconductor device | Chih-Ming Chen, Chin-Cheng Chang, Szu-Yu Wang, Chung-Yi Yu, Ru-Liang Lee | 2017-06-20 |
| 9679980 | Common source oxide formation by in-situ steam oxidation for embedded flash | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Ru-Liang Lee, I-Ting Li +1 more | 2017-06-13 |