Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2017-09-05 |
| 9741850 | Semiconductor device and method for forming the same | Shih-Yin Hsiao, Ching-Chung Yang, Ping-Hung Chiang, Nien-Chung Li, Wen-Fang Lee +2 more | 2017-08-22 |
| 9647060 | Isolation structure and method for fabricating the same | Shih-Yin Hsiao | 2017-05-09 |