Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842816 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Cheng-Hsien Chou, Chih-Hui Huang, Yeur-Luen Tu | 2017-12-12 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2017-09-05 |
| 9698190 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Shyh-Fann Ting, Ching-Chun Wang | 2017-07-04 |
| 9673239 | Image sensor device and method | Yeur-Luen Tu, Cheng-Yuan Tsai | 2017-06-06 |
| 9576827 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2017-02-21 |