Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812483 | Back-side illuminated (BSI) image sensor with global shutter scheme | Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Wei Chuang Wu, Yen-Ting Chiang +1 more | 2017-11-07 |
| 9741665 | Alignment marks in non-STI isolation formation and methods of forming the same | Chun-Wei Chang, Ching-Chun Wang, Dun-Nian Yaung | 2017-08-22 |
| 9728570 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Chih-Hui Huang +2 more | 2017-08-08 |
| 9698190 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Ching-Chun Wang | 2017-07-04 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2017-05-30 |
| 9659981 | Backside illuminated image sensor with negatively charged layer | Chih-Yu Lai, Cheng-Ta Wu, Yeur-Luen Tu, Ching-Chun Wang | 2017-05-23 |
| 9627326 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2017-04-18 |
| 9614000 | Biased backside illuminated sensor shield structure | Feng-Chi Hung, Jhy-Jyi Sze, Ching-Chun Wang, Dun-Nian Yaung | 2017-04-04 |
| 9564468 | Composite grid structure to reduce crosstalk in back side illumination image sensors | Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Wei-Chieh Chiang, Yuichiro Yamashita | 2017-02-07 |
| 9536810 | Flat pad structure for integrating complementary metal-oxide-semiconductor (CMOS) image sensor processes | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Hsiao-Hui Tseng +2 more | 2017-01-03 |