Issued Patents 2017
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2017-12-19 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Shuang-Ji Tsai +3 more | 2017-11-07 |
| 9780137 | Mechanisms for forming image-sensor device with epitaxial isolation feature | Wen-I Hsu, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2017-10-03 |
| 9764153 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2017-09-19 |
| 9761629 | Image sensor device and method | Dun-Nian Yaung, Jen-Cheng Liu, Jeng-Shyan Lin, Shuang-Ji Tsai | 2017-09-12 |
| 9728521 | Hybrid bond using a copper alloy for yield improvement | Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Chih-Hui Huang +2 more | 2017-08-08 |
| 9711548 | Methods of manufacturing semiconductor devices | Jhy-Jyi Sze, Shou-Gwo Wuu | 2017-07-18 |
| 9704827 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung +1 more | 2017-07-11 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2017-05-30 |
| 9666630 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Min-Feng Kao | 2017-05-30 |
| 9666624 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2017-05-30 |
| 9627430 | Method and apparatus for low resistance image sensor contact | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Shuang-Ji Tsai +1 more | 2017-04-18 |
| 9614000 | Biased backside illuminated sensor shield structure | Shyh-Fann Ting, Jhy-Jyi Sze, Ching-Chun Wang, Dun-Nian Yaung | 2017-04-04 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou +2 more | 2017-01-03 |
| 9536810 | Flat pad structure for integrating complementary metal-oxide-semiconductor (CMOS) image sensor processes | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Ming-Tsong Wang +2 more | 2017-01-03 |