Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837464 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2017-12-05 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2017-11-07 |
| 9761629 | Image sensor device and method | Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Jeng-Shyan Lin | 2017-09-12 |
| 9653508 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2017-05-16 |
| 9627430 | Method and apparatus for low resistance image sensor contact | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chun-Chieh Chuang +1 more | 2017-04-18 |
| 9613996 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2017-04-04 |
| 9576999 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou +1 more | 2017-02-21 |
| 9570497 | Back side illuminated image sensor having isolated bonding pads | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2017-02-14 |