Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653508 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai | 2017-05-16 |