Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2017-11-07 |
| 9812409 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Hsin-Hui Lee, Wen-De Wang | 2017-11-07 |
| 9764153 | Interconnect structure and method of forming same | Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2017-09-19 |
| 9754925 | 3DIC interconnect apparatus and method | Dun-Nian Yaung, Jen-Cheng Liu, U-Ting Chen, Shih Pei Chou | 2017-09-05 |
| 9748304 | Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods | U-Ting Chen, Szu-Ying Chen, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2017-08-29 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2017-01-24 |
| 9543257 | 3DIC interconnect devices and methods of forming same | Jeng-Shyan Lin, Dun-Nian Yaung | 2017-01-10 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2017-01-03 |
| 9536920 | Stacked image sensor having a barrier layer | U-Ting Chen, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2017-01-03 |