Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754925 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou | 2017-09-05 |
| 9748304 | Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods | Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2017-08-29 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou, Chia-Chieh Lin | 2017-01-24 |
| 9536920 | Stacked image sensor having a barrier layer | Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2017-01-03 |