Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842785 | Apparatus and method for verification of bonding alignment | Xin-Hua Huang, Ping-Yin Liu | 2017-12-12 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more | 2017-10-10 |
| 9754827 | Semiconductor device and fabrication method thereof | Chun-Han Tsao, Chih-Ming Chen, Han-Yu Chen, Szu-Yu Wang, Cheng-Yuan Tsai | 2017-09-05 |
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2017-08-29 |
| 9741681 | Debonding schemes | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Chia-Shiung Tsai | 2017-08-22 |
| 9735033 | Multiple swivel arm design in hybrid bonder | Xin-Hua Huang, Ping-Yin Liu | 2017-08-15 |
| 9725310 | Micro electromechanical system sensor and method of forming the same | Chun-Wen Cheng, Hung-Chia Tsai, Yuan-Chih Hsieh, Ping-Yin Liu | 2017-08-08 |
| 9708179 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Li-Cheng Chu, Hung-Hua Lin, Chih-Jen Chan | 2017-07-18 |
| 9646860 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Xiaomeng Chen, Ping-Yin Liu | 2017-05-09 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2017-04-04 |
| 9576827 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Yeur-Luen Tu, Ru-Liang Lee | 2017-02-21 |
| 9533876 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng +2 more | 2017-01-03 |