Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9834436 | Cap and substrate electrical connection at wafer level | — | 2017-12-05 |
| 9834435 | Structure and formation method of semiconductor device structure | Ping-Yin Liu, Xin-Hua Huang, Yeong-Jyh Lin | 2017-12-05 |
| 9828234 | Semiconductor MEMS structure and manufacturing method thereof | Yuan-Chih Hsieh, Hsing-Lien Lin, Yi-Chien Wu | 2017-11-28 |
| 9822000 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Chia-Hua Chu | 2017-11-21 |
| 9695039 | Multi-pressure MEMS package | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Kuei-Sung Chang | 2017-07-04 |
| 9677884 | Methods of forming a gyroscope sensor and a structure for a gyroscope sensors | Ting-Hau Wu, Chun-Ren Cheng, Jiou-Kang Lee, Shang-Ying Tsai | 2017-06-13 |
| 9673169 | Method and apparatus for a wafer seal ring | Yi-Chuan Teng, Shang-Ying Tsai, Hsin-Ting Huang, Li-Min Hung, Yao-Te Huang +1 more | 2017-06-06 |
| 9656260 | Method to produce chemical pattern in micro-fluidic structure | Shang-Ying Tsai, Li-Min Hung | 2017-05-23 |
| 9643838 | Semiconductor device and package and manufacturing method thereof | Chia-Hua Chu, Yi-Chien Wu, Li-Min Hung | 2017-05-09 |
| 9630831 | Semiconductor sensing structure | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2017-04-25 |
| 9617143 | Semiconductor device | Chun-Wen Cheng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2017-04-11 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2017-04-04 |
| 9545691 | Method of removing waste of substrate and waste removing device thereof | Chin-Yi Cho, Yi-Chuan Teng, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang | 2017-01-17 |
| 9533876 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2017-01-03 |