Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9695039 | Multi-pressure MEMS package | Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Jung-Huei Peng | 2017-07-04 |
| 9691725 | Integrated semiconductor device and wafer level method of fabricating the same | Chun-Wen Cheng, Alexander Kalnitsky, Chia-Hua Chu | 2017-06-27 |
| 9586811 | Semiconductor devices with moving members and methods for making the same | Chia-Hua Chu, Chung-Hsien Lin | 2017-03-07 |
| 9567210 | Multi-pressure MEMS package | Chun-Wen Cheng, Chia-Hua Chu | 2017-02-14 |