Issued Patents 2017
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850125 | MEMS integrated pressure sensor devices having isotropic cavitites and methods of forming same | Chun-Wen Cheng | 2017-12-26 |
| 9822000 | MEMS and CMOS integration with low-temperature bonding | Chun-Wen Cheng, Jung-Huei Peng | 2017-11-21 |
| 9796582 | Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer | Chun-Wen Cheng | 2017-10-24 |
| 9791406 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chun-Ren Cheng, Chun-Wen Cheng | 2017-10-17 |
| 9776856 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Yi-Chuan Teng, Hung-Chia Tsai | 2017-10-03 |
| 9725301 | Structures and formation methods of micro-electro mechanical system device | Chun-Wen Cheng, Shang-Ying Tsai, Chin-Wei Liang | 2017-08-08 |
| 9718669 | MEMS pressure sensor and method of manufacturing the same | Tung-Tsun Chen | 2017-08-01 |
| 9695039 | Multi-pressure MEMS package | Yu-Chia Liu, Chun-Wen Cheng, Kuei-Sung Chang, Jung-Huei Peng | 2017-07-04 |
| 9691725 | Integrated semiconductor device and wafer level method of fabricating the same | Kuei-Sung Chang, Chun-Wen Cheng, Alexander Kalnitsky | 2017-06-27 |
| 9650239 | MEMS integrated pressure sensor and microphone devices and methods of forming same | Chun-Wen Cheng | 2017-05-16 |
| 9643838 | Semiconductor device and package and manufacturing method thereof | Jung-Huei Peng, Yi-Chien Wu, Li-Min Hung | 2017-05-09 |
| 9630831 | Semiconductor sensing structure | Jung-Huei Peng, Fei-Lung Lai, Shiang-Chi Lin | 2017-04-25 |
| 9630837 | MEMS structure and manufacturing method thereof | Chun-Wen Cheng | 2017-04-25 |
| 9617150 | Micro-electro mechanical system (MEMS) device having a blocking layer formed between closed chamber and a dielectric layer of a CMOS substrate | Chun-Wen Cheng | 2017-04-11 |
| 9617147 | Dual layer microelectromechanical systems device and method of manufacturing same | Chun-Wen Cheng, Jiou-Kang Lee, Kai-Chih Liang, Chung-Hsien Lin, Te-Hao Lee | 2017-04-11 |
| 9604843 | MEMS devices and methods for forming same | Chun-Wen Cheng | 2017-03-28 |
| 9586811 | Semiconductor devices with moving members and methods for making the same | Kuei-Sung Chang, Chung-Hsien Lin | 2017-03-07 |
| 9573806 | MEMS device structure with a capping structure | Chun-Wen Cheng | 2017-02-21 |
| 9567206 | Structures and formation methods of micro-electro mechanical system device | Chun-Wen Cheng, Shang-Ying Tsai, Chin-Wei Liang | 2017-02-14 |
| 9567210 | Multi-pressure MEMS package | Chun-Wen Cheng, Kuei-Sung Chang | 2017-02-14 |
| 9567209 | Semiconductor structure and manufacturing method thereof | Chun-Wen Cheng, Fei-Lung Lai, Shiang-Chi Lin | 2017-02-14 |
| 9550666 | MEMS device with release aperture | Chung-Hsien Lin, Chun-Wen Cheng | 2017-01-24 |