Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9776856 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Hung-Chia Tsai, Chia-Hua Chu | 2017-10-03 |
| 9673169 | Method and apparatus for a wafer seal ring | Jung-Huei Peng, Shang-Ying Tsai, Hsin-Ting Huang, Li-Min Hung, Yao-Te Huang +1 more | 2017-06-06 |
| 9656852 | CMOS-MEMS device structure, bonding mesa structure and associated method | Chun-Wen Cheng | 2017-05-23 |
| 9617143 | Semiconductor device | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai | 2017-04-11 |
| 9567208 | Semiconductor device and method for fabricating the same | Chun-Wen Cheng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Wei Lin | 2017-02-14 |
| 9545691 | Method of removing waste of substrate and waste removing device thereof | Chin-Yi Cho, Shang-Ying Tsai, Li-Min Hung, Yao-Te Huang, Jung-Huei Peng | 2017-01-17 |