Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9776856 | Vacuum sealed MEMS and CMOS package | Chun-Wen Cheng, Yi-Chuan Teng, Chia-Hua Chu | 2017-10-03 |
| 9725310 | Micro electromechanical system sensor and method of forming the same | Chun-Wen Cheng, Lan-Lin Chao, Yuan-Chih Hsieh, Ping-Yin Liu | 2017-08-08 |
| 9617143 | Semiconductor device | Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Yi-Chuan Teng | 2017-04-11 |