Issued Patents 2017
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842785 | Apparatus and method for verification of bonding alignment | Xin-Hua Huang, Lan-Lin Chao | 2017-12-12 |
| 9834435 | Structure and formation method of semiconductor device structure | Xin-Hua Huang, Yeong-Jyh Lin, Jung-Huei Peng | 2017-12-05 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Chen-Jong Wang, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2017-10-10 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2017-09-05 |
| 9748198 | Hybrid bonding systems and methods for semiconductor wafers | Shih-Wei Lin, Xin-Hua Huang, Lan-Lin Chao, Chia-Shiung Tsai | 2017-08-29 |
| 9741681 | Debonding schemes | Xin-Hua Huang, Hung-Hua Lin, Lan-Lin Chao, Chia-Shiung Tsai | 2017-08-22 |
| 9735033 | Multiple swivel arm design in hybrid bonder | Xin-Hua Huang, Lan-Lin Chao | 2017-08-15 |
| 9728453 | Methods for hybrid wafer bonding integrated with CMOS processing | Pin-Nan Tseng, Chia-Shiung Tsai | 2017-08-08 |
| 9725310 | Micro electromechanical system sensor and method of forming the same | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh | 2017-08-08 |
| 9711555 | Dual facing BSI image sensors with wafer level stacking | Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2017-07-18 |
| 9704820 | Semiconductor manufacturing method and associated semiconductor manufacturing system | Xin-Hua Huang, Yung-Lung Lin, Chia-Shiung Tsai | 2017-07-11 |
| 9646860 | Alignment systems and wafer bonding systems and methods | Xin-Hua Huang, Xiaomeng Chen, Lan-Lin Chao | 2017-05-09 |
| 9627243 | Method and apparatus of holding a device | Chung-Yi Yu, Che Ying Hsu, Yeur-Luen Tu, Da-Hsiang Chou, Chia-Shiung Tsai | 2017-04-18 |
| 9611141 | Self-removal anti-stiction coating for bonding process | Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh, Jung-Huei Peng +3 more | 2017-04-04 |
| 9576827 | Apparatus and method for wafer level bonding | Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Ru-Liang Lee | 2017-02-21 |
| 9533876 | MEMS structures and methods for forming the same | Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng, Lan-Lin Chao +2 more | 2017-01-03 |