Issued Patents 2017
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9771256 | Micro electro mechanical system (MEMS) device having via extending through plug | Chung-Yen Chou, Lee-Chuan Tseng, Chia-Shiung Tsai | 2017-09-26 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Chih-Hui Huang, Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai +2 more | 2017-09-05 |
| 9748255 | Split gate memory devices and methods of manufacturing | Chang-Ming Wu, Shih-Chang Liu, Chia-Shiung Tsai | 2017-08-29 |
| 9738516 | Structure to reduce backside silicon damage | Chung-Yen Chou, Chih-Jen Chan, Chia-Shiung Tsai, Yuan-Chih Hsieh | 2017-08-22 |
| 9685518 | Method of forming semiconductor structure of control gate, and semiconductor device | Chih-Ming Chen, Chin-Cheng Chang, Szu-Yu Wang, Chung-Yi Yu, Chia-Shiung Tsai | 2017-06-20 |
| 9679979 | Semiconductor structure for flash memory cells and method of making same | Ming Chyi Liu, Chang-Ming Wu, Shih-Chang Liu, Wei-Cheng Wu, Harry-Hak-Lay Chuang +1 more | 2017-06-13 |
| 9679980 | Common source oxide formation by in-situ steam oxidation for embedded flash | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Chia-Shiung Tsai, I-Ting Li +1 more | 2017-06-13 |
| 9673205 | Embedded nonvolatile memory and forming method thereof | Chang-Ming Wu, Wei-Cheng Wu, Yuan-Tai Tseng, Shih-Chang Liu, Chia-Shiung Tsai +1 more | 2017-06-06 |
| 9634096 | Semiconductor device with trench isolation | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Chia-Shiung Tsai, Tung-I Lin +1 more | 2017-04-25 |
| 9620372 | HK embodied flash memory and methods of forming the same | Ming Chyi Liu, Wei-Hang Huang, Yu-Hsing Chang, Chang-Ming Wu, Wei-Cheng Wu +3 more | 2017-04-11 |
| 9595589 | Transistor with performance boost by epitaxial layer | Yu-Hung Cheng, Cheng-Ta Wu, Yeur-Luen Tu, Chia-Shiung Tsai, Tung-I Lin +1 more | 2017-03-14 |
| 9595521 | Capacitive device | Chung-Yen Chou, Po-ken Lin, Chia-Shiung Tsai | 2017-03-14 |
| 9576827 | Apparatus and method for wafer level bonding | Ping-Yin Liu, Yen-Chang Chu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu | 2017-02-21 |
| 9577191 | RRAM cell bottom electrode formation | Trinh Hai Dang, Hsing-Lien Lin, Kai-Wen Cheng, Cheng-Yuan Tsai, Chia-Shiung Tsai | 2017-02-21 |