Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741638 | Thermal structure for integrated circuit package | Cheng-Chieh Hsieh, Shin-Puu Jeng, Shang-Yun Hou | 2017-08-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741638 | Thermal structure for integrated circuit package | Cheng-Chieh Hsieh, Shin-Puu Jeng, Shang-Yun Hou | 2017-08-22 |