Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806038 | Reinforcement structure and method for controlling warpage of chip mounted on substrate | Chen-Hua Yu, Shang-Yun Hou, Cheng-Chieh Hsieh | 2017-10-31 |
| 9786614 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, An-Jhih Su | 2017-10-10 |
| 9691686 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2017-06-27 |
| 9613931 | Fan-out stacked system in package (SIP) having dummy dies and methods of making the same | Hsien-Wei Chen, Cheng-Chieh Hsieh, Chang-Chia Huang | 2017-04-04 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Chun-Hung Lin, Yu-Feng Chen, Han-Ping Pu, Hsien-Wei Chen | 2017-01-24 |
| 9548283 | Package redistribution layer structure and method of forming same | Hung-Jui Kuo, Yi-Wen Wu | 2017-01-17 |