Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Ming-Da Cheng, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2017-07-04 |
| 9691738 | Bonding package components through plating | Zheng-Yi Lim, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2017-06-27 |
| 9685372 | Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap | Chien Ling Hwang, Hui-Jung Tsai, Chung-Shi Liu | 2017-06-20 |
| 9653418 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Ming-Che Ho | 2017-05-16 |
| 9607921 | Package on package interconnect structure | Wen-Hsiung Lu, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-28 |
| 9601355 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2017-03-21 |
| 9559070 | Post-passivation interconnect structure and method of forming same | Hsien-Wei Chen | 2017-01-31 |
| 9548283 | Package redistribution layer structure and method of forming same | Tsung-Shu Lin, Hung-Jui Kuo | 2017-01-17 |