Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691738 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2017-06-27 |
TY
Tzong-Hann Yang
Overall (2017): #208,044 of 506,227Top 45%
1
Patents 2017