Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691738 | Bonding package components through plating | Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2017-06-27 |
ZL
Zheng-Yi Lim
Overall (2017): #178,459 of 506,227Top 40%
1
Patents 2017