Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9718991 | Chemical mechanical polishing slurry | Yi Yang, Wen-Cheng Liu, Ming-Hui Lu, Song-Yuan Chang | 2017-08-01 |
| 9691738 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Chung-Shi Liu | 2017-06-27 |
| 9659796 | Rinsing wafers using composition-tunable rinse water in chemical mechanical polish | Cheng-Hsun Chan | 2017-05-23 |
| 9653418 | Packaging devices and methods | Shih-Wei Liang, Kai-Chiang Wu, Yi-Wen Wu | 2017-05-16 |
| 9601355 | Via structure for packaging and a method of forming | Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2017-03-21 |