Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812346 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin | 2017-11-07 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2017-10-31 |
| 9768142 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2017-09-19 |
| 9735039 | Apparatus for separating wafer from carrier | Lin-Wei Wang, Chung-Shi Liu | 2017-08-15 |
| 9700950 | Innovative multi-purpose dipping plate | Bor-Ping Jang, Lin-Wei Wang, Ying-Jui Huang, Yi-Li Hsiao, Chung-Shi Liu | 2017-07-11 |
| 9685372 | Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap | Hui-Jung Tsai, Yi-Wen Wu, Chung-Shi Liu | 2017-06-20 |
| 9659891 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Yeong-Jyh Lin, Bor-Ping Jang, Hsiao-Chung Liang | 2017-05-23 |
| 9601355 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2017-03-21 |