Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768142 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Chung-Shi Liu | 2017-09-19 |
| 9659891 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Yeong-Jyh Lin, Bor-Ping Jang | 2017-05-23 |