Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768137 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9627369 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9607921 | Package on package interconnect structure | Wen-Hsiung Lu, Yi-Wen Wu, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-28 |
| 9570410 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2017-02-14 |
| 9536865 | Interconnection joints having variable volumes in package structures and methods of formation thereof | Hsuan-Ting Kuo, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen +1 more | 2017-01-03 |
| 9538582 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2017-01-03 |