Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799631 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng | 2017-10-24 |
| 9768137 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9627234 | Method and apparatus for localized and controlled removal of material from a substrate | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9583464 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng | 2017-02-28 |
| 9538582 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2017-01-03 |