Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799631 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2017-10-24 |
| 9786622 | Semiconductor package | Ming-Da Cheng, Chih-Wei Lin, Yu-Peng Tsai, Chun-Cheng Lin, Chung-Shi Liu | 2017-10-10 |
| 9673182 | Package on package bonding structure and method for forming the same | Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-06-06 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Chung-Shi Liu | 2017-05-30 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Yu-Feng Chen, Chen-Shien Chen | 2017-03-07 |
| 9583464 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2017-02-28 |
| 9543185 | Packaging process tools and systems, and packaging methods for semiconductor devices | Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-10 |