Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799620 | Warpage reduction and adhesion improvement of semiconductor die package | Yen-Chang Hu, Ching-Wen Hsiao, Chen-Shien Chen | 2017-10-24 |
| 9691708 | Semiconductor package and manufacturing method thereof | Chih-Hua Chen, Chih-Wei Lin, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Chun-Cheng Lin, Kuei-Wei Huang, Yu-Feng Chen, Chen-Shien Chen | 2017-03-07 |