Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799620 | Warpage reduction and adhesion improvement of semiconductor die package | Yu-Chih Huang, Ching-Wen Hsiao, Chen-Shien Chen | 2017-10-24 |
| 9735087 | Wafer level embedded heat spreader | Wei Sen Chang, Tsung-Hsien Chiang, Ching-Wen Hsiao | 2017-08-15 |