Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735087 | Wafer level embedded heat spreader | Tsung-Hsien Chiang, Yen-Chang Hu, Ching-Wen Hsiao | 2017-08-15 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng +2 more | 2017-05-30 |
| 9659896 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Guan-Yu Chen, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2017-05-23 |
| 9640521 | Multi-die package with bridge layer and method for making the same | Yu-Feng Chen, Chen-Shien Chen, Mirng-Ji Lii | 2017-05-02 |
| 9627339 | Method of forming an integrated circuit device including a pillar capped by barrier layer | — | 2017-04-18 |
| 9620465 | Dual-sided integrated fan-out package | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2017-04-11 |
| 9543278 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Shou-Cheng Hu | 2017-01-10 |