Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837289 | Methods for forming package-on-package structures having buffer dams | Ching-Wen Hsiao, Chen-Shien Chen | 2017-12-05 |
| 9543278 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang | 2017-01-10 |