Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850126 | Integrated circuit package and method of forming same | Chung-Shi Liu, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng | 2017-12-26 |
| 9837346 | Packaging device having plural microstructures disposed proximate to die mounting region | Yu-Feng Chen, Chen-Shien Chen | 2017-12-05 |
| 9773749 | Warpage control of semiconductor die package | Ching-Wen Hsiao, Chen-Shien Chen | 2017-09-26 |
| 9735130 | Chip packages and methods of manufacture thereof | Ying-Jui Huang, Yu-Feng Chen, Chen-Shien Chen | 2017-08-15 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Yu-Jen Cheng, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9620465 | Dual-sided integrated fan-out package | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2017-04-11 |
| 9607959 | Packaging device having plural microstructures disposed proximate to die mounting region | Yu-Feng Chen, Chen-Shien Chen | 2017-03-28 |