Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9850126 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Hao-Yi Tsai, Yu-Feng Chen | 2017-12-26 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Hao-Yi Tsai, Yu-Feng Chen +1 more | 2017-06-27 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Mirng-Ji Lii +2 more | 2017-05-30 |